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ADD8704ARU-REEL View Datasheet(PDF) - Analog Devices

Part Name
Description
View to exact match
ADD8704ARU-REEL
ADI
Analog Devices ADI
ADD8704ARU-REEL Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
ADD8704
OUTLINE DIMENSIONS
5.10
5.00
4.90
14
8
4.50
4.40
4.30
1
6.40
BSC
7
PIN 1
1.05
0.65
1.00
BSC
0.80
1.20 0.20
MAX 0.09
0.75
0.15 0.30
0.05 0.19
SEATING
PLANE
COPLANARITY
0.10
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153AB-1
Figure 38. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU)
Dimensions shown in millimeters
4.0
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
PIN 1
INDICATOR
TOP
VIEW
3.75
BSC SQ
0.65 BSC
0.75
0.60
0.50
13
16
12
1
BOTTOM
VIEW
9
4
8
5
2.25
2.10 SQ
1.95
0.25 MIN
12° MAX
0.80 MAX
0.65 TYP
1.95 BSC
1.00
0.85
0.80
SEATING
PLANE
0.05 MAX
0.02 NOM
0.35
0.28 0.20 REF
0.25
COPLANARITY
0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
Figure 39. 16-Terminal Leadless Frame Chip Scale Package [LFCSP] (CP)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADD8704ARU
ADD8704ARU-REEL
ADD8704ARUZ1
ADD8704ARUZ-REEL1
ADD8704ACPZ-R21
ADD8704ACPZ-REEL71
1 Z = Pb-free part.
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
14-Lead Thin Shrink SOIC
14-Lead Thin Shrink SOIC
14-Lead Thin Shrink SOIC
14-Lead Thin Shrink SOIC
16-Terminal Leadless Frame Chip Scale
16-Terminal Leadless Frame Chip Scale
Package Option
RU-14
RU-14
RU-14
RU-14
CP-16
CP-16
Rev. 0 | Page 14 of 16
 

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