AD9683-170EBZ View Datasheet(PDF) - Analog Devices
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AD9683-170EBZ Datasheet PDF : 44 Pages
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AD9683
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Electrical
AVDD to AGND
DRVDD to DRGND
DVDD to DGND
VIN+, VIN− to AGND
CLK+, CLK− to AGND
RFCLK to AGND
VCM to AGND
CS, PDWN to DGND
SCLK to DGND
SDIO to DGND
RST to DGND
FD to DGND
SERDOUT0+, SERDOUT0− to AGND
SYNCINB+, SYNCINB− to DGND
SYSREF+, SYSREF− to AGND
Environmental
Operating Temperature Range
(Ambient)
Maximum Junction Temperature
Under Bias
Storage Temperature Range
(Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−40°C to +85°C
150°C
−65°C to +125°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Data Sheet
THERMAL CHARACTERISTICS
The exposed pad must be soldered to the ground plane of the
LFCSP package. This increases the reliability of the solder
joints, maximizing the thermal capability of the package.
Table 7. Thermal Resistance
Package Type
Airflow
Velocity
(m/sec)
θJA1, 2
32-Lead LFCSP 0
37.1
5 mm × 5 mm 1.0
32.4
(CP-32-12)
2.5
29.1
θJC1, 3, 4
3.1
N/A
N/A
θJB1, 4, 5
20.7
N/A
N/A
1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-STD-883, Method 1012.1.
4 N/A = not applicable.
5 Per JEDEC JESD51-8 (still air).
Unit
°C/W
°C/W
°C/W
Typical θJA is specified for a 4-layer printed circuit board (PCB)
with a solid ground plane. As shown in Table 7, airflow increases
heat dissipation, which reduces θJA. In addition, metal in direct
contact with the package leads from metal traces, through holes,
ground, and power planes reduces the θJA.
ESD CAUTION
Rev. 0 | Page 10 of 44
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