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AD96687BP View Datasheet(PDF) - Analog Devices

Part Name
Description
View to exact match
AD96687BP
ADI
Analog Devices ADI
AD96687BP Datasheet PDF : 6 Pages
1 2 3 4 5 6
AD96685/AD96687
SYSTEM TIMING DIAGRAM
tS – Minimum Setup Time
tH – Minimum Hold Time
tPD – Input to Output Delay
tPD(E) – LATCH ENABLE to Output Delay
tPW(E) – Minimum LATCH ENABLE Pulse Width
VOS – Input Offset Voltage
VOD – Overdrive Voltage
DIE LAYOUT AND MECHANICAL INFORMATION
Die Dimensions (AD96685) . . . . . . . . 44 ϫ 50 ϫ 15 (± 2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 ϫ 4 mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride
Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Eutectic
Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding
or 1 mil, Gold, Gold Ball Bonding
Die Dimensions (AD96687) . . . . . . . . 77 ϫ 60 ϫ 15 (± 2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 ϫ 4 mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride
Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Eutectic
Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding
or 1 mil, Gold, Gold Ball Bonding
–4–
REV. C
 

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