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AD9237 View Datasheet(PDF) - Analog Devices

Part Name
Description
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AD9237 Datasheet PDF : 28 Pages
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AD9237
OUTLINE DIMENSIONS
PIN 1
INDICATOR
5.00
BSC SQ
TOP
VIEW
4.75
BSC SQ
12° MAX
0.80 MAX
0.65 TYP
0.60 MAX
0.50
BSC
0.50
0.40
0.30
0.60 MAX
25
32
24
1
PIN 1
INDICATOR
EXPOSED
PAD
(BOTTOM VIEW)
3.25
3.10 SQ
2.95
17
8
16
9
0.25 MIN
3.50 REF
0.05 MAX
1.00
0.02 NOM
0.85
0.30
0.80
SEATING
0.23
0.20 REF
PLANE
0.18
COPLANARITY
0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 57. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD9237BCPZ-201, 2
AD9237BCPZRL7-201, 2
AD9237BCPZ-401, 2
AD9237BCPZRL7-401, 2
AD9237BCPZ-651, 2
AD9237BCPZRL7-651, 2
AD9237BCP-20EB
AD9237BCP-40EB
AD9237BCP-65EB
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
Evaluation Board
Evaluation Board
Package Option
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
1 Z = Pb-free part.
2 It is recommended that the exposed paddle be soldered to the ground plane. There is an increased reliability of the solder joints and maximum thermal capability of
the package is achieved with exposed paddle soldered to the customer board.
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05455–0–10/05(0)
T
T
Rev. 0 | Page 28 of 28
 

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