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AD9211-200EB View Datasheet(PDF) - Analog Devices

Part NameDescriptionManufacturer
AD9211-200EB 10-Bit, 200 MSPS/250 MSPS/300 MSPS, 1.8 V Analog-to-Digital Converter ADI
Analog Devices ADI
AD9211-200EB Datasheet PDF : 28 Pages
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AD9211
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
ELECTRICAL
AVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
D0+/D0− through D9+/D9−
to DRGND
DCO to DRGND
OR to DGND
CLK+ to AGND
CLK− to AGND
VIN+ to AGND
VIN− to AGND
SDIO/DCS to DGND
PWDN to AGND
CSB to AGND
SCLK/DFS to AGND
ENVIRONMENTAL
Storage Temperature Range
Operating Temperature Range
Lead Temperature
(Soldering 10 sec)
Junction Temperature
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane
for the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6.
Package Type
θJA
θJC
56-Lead LFCSP (CP-56-2)
30.4
2.9
Unit
°C/W
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal in direct contact with the package leads from
metal traces, and through holes, ground, and power planes
reduces the θJA.
ESD CAUTION
Rev. 0 | Page 8 of 28
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