AD9148-EBZ View Datasheet(PDF) - Analog Devices
Part Name
Description
View to exact match
AD9148-EBZ Datasheet PDF : 72 Pages
| |||
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD33, IOVDD
DVDD18, CVDD18
AGND
DGND
CGND
I120, VREF
IOUT1_P, IOUT1_N,
IOUT2_P, IOUT2_N,
IOUT3_P, IOUT3_N,
IOUT4_P, IOUT4_N
A15_P to A0_P,
A15_N to A0_N,
B15_P to B0_P,
B15_N, B0_N
DCIA_P, DCIA_N,
FRAMEA_P, FRAMEA_N,
DCIB_P, DCIB_N,
FRAMEB_P, FRAMEB_N
CLK_P, CLK_N,
REFCLK_P, REFCLK_N
CSB, SCLK, SDIO, SDO,
TDO, TDI, TCK, TMS,
RESET, IRQ, PLL_LOCK
Junction Temperature
Storage Temperature
Range
With
Respect To
AGND,
DGND,
CGND
AGND,
DGND,
CGND
DGND,
CGND
AGND,
CGND
AGND,
DGND
AGND
AGND
DGND
DGND
CGND
DGND
Rating
−0.3 V to +3.6 V
−0.3 V to +2.10 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−1.0 V to AVDD33 + 0.3 V
−0.3 V to DVDD18 + 0.3 V
−0.3 V to DVDD18+ 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to IOVDD + 0.3 V
125°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Typical θJA, θJB, and θJC are specified vs. the number of PCB layers in
still air for each package offering. Airflow increases heat dissipation
effectively reducing θJA and θJB.
AD9148
Table 7. Thermal Resistance
Package Type
θJA θJB θJC Unit Notes
196-Ball CSP_BGA 24.7 12.6 5.7 °C/W 4-layer board,
25 PCB vias
19.2 10.9 5.3 °C/W 8-layer board,
25 PCB vias
18.1 10.5 5.3 °C/W 10-layer board,
25 PCB vias
18.0 10.5 5.3 °C/W 12-layer board,
25 PCB vias
196-Ball BGA_ED
20.9 8.6 3.1 °C/W 4-layer board,
25 PCB vias
16.2 7.7 3.1 °C/W 8-layer board,
25 PCB vias
15.2 7.4 3.1 °C/W 10-layer board,
25 PCB vias
15.0 7.4 3.1 °C/W 12-layer board,
25 PCB vias
MAXIMUM SAFE POWER DISSIPATION
The maximum junction temperature for the AD9148 is 125°C.
With the thermal resistance of the molded package (CSP_BGA)
given for a 12 layer board, the maximum power that can be
dissipated in this package can be calculated as
( ) PowerMAX
=
TJ −TA
θ JA
= (125 − 85) = 2.22 W
18.0
To increase the maximum power, the AD9148 is available in a
second package option (BGA_ED), which includes a heat spreader
on top of the package. Also, an external heat sink can be attached to
the top of the AD9148 CSP_BGA package. The adjusted maximum
power for each of these conditions is shown in Table 8.
With the thermal resistance of the heat spreader package (BGA_ED)
given for a 12-layer board, the maximum power that can be
dissipated in this package can be calculated as
( ) PowerMAX
=
TJ −TA
θ JA
= (125 − 85) = 2.67 W
15.0
To increase the maximum power, an external heat sink can be
attached to the top of the AD9148 BGA_ED package. The adjusted
maximum power for an external heat sink is shown in Table 8.
To aid in the selection of package, the maximum fDAC rate for a given
power dissipation over several operating conditions is shown in
Table 9. The maximum fDAC rate applies to all interpolation rates.
Note that, if the programmable inverse sinc filter is enabled, the
maximum fDAC rate specified in Table 9 decreases.
ESD CAUTION
Rev. B | Page 9 of 72
|
|
Share Link: 