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AD9119-MIX-EBZ View Datasheet(PDF) - Analog Devices

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AD9119-MIX-EBZ Datasheet PDF : 68 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
DCI, DCO to VSS
LVDS Data Inputs to VSS
IOUTP, IOUTN to VSSA
I250U, VREF to VSSA
IRQ, CS, SCLK, SDO, SDIO, RESET,
SYNC to VSS
Junction Temperature
Operating Temperature Range
Storage Temperature Range
Rating
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
VSSA − 0.3V to +2.5V
VSSA − 0.3 V to VDDA + 0.3 V
−0.3 V to VDD + 0.3 V
150°C
−40°C to +85°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD9119/AD9129
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
θJA
θJC
160-Ball CSP_BGA
31.2
7.0
Unit
°C/W1
1 With no airflow movement.
ESD CAUTION
Rev. 0 | Page 7 of 68
 

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