AD9106-EBZ View Datasheet(PDF) - Analog Devices
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AD9106-EBZ
Analog Devices
AD9106-EBZ Datasheet PDF : 48 Pages
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AD9106
ABSOLUTE MAXIMUM RATINGS
Table 9.
Parameter
AVDD1, AVDD2, DVDD to AGND,
DGND, CLKGND
CLKVDD to AGND, DGND, CLKGND
CLDO, DLDO1, DLDO2 to AGND,
DGND, CLKGND
AGND to DGND, CLKGND
DGND to AGND, CLKGND
CLKGND to AGND, DGND
CSE, SDIO, SCLK, SDO/SDI2/DOUT,
A
A
RESETE, TRIGGERE to DGND
A
A
A
A
CLKP, CLKN to CLKGND
REFIO to AGND
IOUTP1, IOUTN1, IOUTP2, IOUTN2,
IOUTP3, IOUTN3, IOUTP4, IOUTN4 to
AGND
FSADJ1, FSADJ2/CAL_SENSE, F4DJ3,
FSADJ4 to AGND
Junction Temperature
Storage Temperature
Rating
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +2.2 V
−0.3 V to +0.3V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to CLKVDD + 0.3 V
−1.0 V to AVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
125 οC
−65 οC to +150 οC
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Data Sheet
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a standard circuit board for surface-mount
packages. θJC is measured from the solder side (bottom) of the
package.
Table 10. Thermal Resistance
Package Type
θJA
θJB
θJC
Unit
32-Lead LFCSP with
Exposed Paddle
30.18 6.59 3.84 οC/W
ESD CAUTION
Rev. A | Page 10 of 48
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