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AD9058 View Datasheet(PDF) - Analog Devices

Part Name
Description
View to exact match
AD9058
ADI
Analog Devices ADI
AD9058 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
MECHANICAL INFORMATION
Die Dimensions . . . . . . . . . 106 mils × 108 mils × 15 (± 2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 4 mils × 4 mils
Metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nitride
Die Attach . . . . . . . . . . . . . . . . . . . . Gold Eutectic (Ceramic)
Bond Wire . . . . . . . . . 1 mil–1.3 mil, Gold; Gold Ball Bonding
AIN
+VS
GROUND
+VREF
COMP
+VINT
+VREF
GROUND
+VS
AIN
AD9058
D0 (LSB)
GROUND
–VS
GROUND
+VS
+VS
GROUND
–VS
GROUND
D0 (LSB)
REV. E
–9–
 

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