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ACPL-K73L-560E View Datasheet(PDF) - Avago Technologies

Part Name
Description
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ACPL-K73L-560E Datasheet PDF : 14 Pages
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Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
200
2.5 C ± 0.5 °C/SEC.
160°C
150°C
30
SEC.
140°C
30
3°C + 1°C/–0.5°C
SEC.
100
PREHEATING TIME
150°C, 90 + 30 SEC.
ROOM
TEMPERATURE
00
50
Note: Non-halide flux should be used.
100
150
TIME (SECONDS)
PEAK
TEMP.
240°C
SOLDERING
TIME
200°C
PEAK
TEMP.
230°C
50 SEC.
200
TIGHT
TYPICAL
LOOSE
250
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
tp
Tp
TL 217 °C
Tsmax
Tsmin
150 - 200 °C
260 +0/-5 °C
RAMP-UP
3 °C/SEC. MAX.
ts
PREHEAT
tL
60 to 180 SEC.
20-40 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
60 to 150 SEC.
25
t 25 °C to PEAK
TIME
Notes:
The time from 25 °C to peak temperature = 8 minutes max.
Tsmax = 200 °C, Tsmin = 150 °C
Non-halide ux should be used
Regulatory Information
The ACPL-W70L and ACPL-K73L are approved by the fol-
lowing organizations:
UL
Recognized under UL 1577, component recognition pro-
gram, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA88324.
IEC/EN/DIN EN 60747-5-2
Approval under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01 (Option 060 only)
4
 

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