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74LVT16244B View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
View to exact match
74LVT16244B
NXP
NXP Semiconductors. NXP
74LVT16244B Datasheet PDF : 17 Pages
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74LVT16244B; 74LVTH16244B
3.3 V 16-bit buffer/driver; 3-state
Rev. 06 — 13 November 2008
Product data sheet
1. General description
The 74LVT16244B; 74LVTH16244B is a high-performance BiCMOS product designed for
VCC operation at 3.3 V.
This device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs.
The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.
2. Features
I 16-bit bus interface
I 3-state buffers
I Output capability: +64 mA and 32 mA
I TTL input and output switching levels
I Input and output interface capability to systems at 5 V supply
I Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs
I Power-up 3-state
I Live insertion and extraction permitted
I No bus current loading when output is tied to 5 V bus
I Latch-up protection
N JESD78 Class II exceeds 500 mA
I ESD protection:
N HBM JESD22-A114E exceeds 2000 V
N MM JESD22-A115-A exceeds 200 V
3. Ordering information
Table 1. Ordering information
Type number
Package
Temperature range
74LVT16244BDL
40 °C to +85 °C
74LVTH16244BDL
74LVT16244BDGG 40 °C to +85 °C
74LVTH16244BDGG
74LVT16244BEV
40 °C to +85 °C
74LVT16244BBQ
74LVTH16244BBQ
40 °C to +125 °C
Name
SSOP48
Description
plastic shrink small outline package; 48 leads;
body width 7.5 mm
TSSOP48 plastic thin shrink small outline package;
48 leads; body width 6.1 mm
VFBGA56 plastic very thin fine-pitch ball grid array
package; 56 balls; body 4.5 × 7 × 0.65 mm
HUQFN60U plastic thermal enhanced ultra thin quad flat
package; no leads; 60 terminals; UTLP based;
body 4 x 6 x 0.55 mm
Version
SOT370-1
SOT362-1
SOT702-1
SOT1025-1
 

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