NXP Semiconductors
74LVT16244B; 74LVTH16244B
3.3 V 16-bit buffer/driver; 3-state
12. Package outline
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm
SOT370-1
D
y
Z
48
pin 1 index
1
e
c
25
E
A
X
HE
vM A
24
wM
bp
A2
A1
Q
A
(A 3)
θ
Lp
L
detail X
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.8
0.4
0.2
2.35
2.20
0.25
0.3
0.2
0.22 16.00
0.13 15.75
7.6
7.4
0.635
10.4
10.1
1.4
1.0
0.6
1.2
1.0
0.25 0.18
0.1
0.85
0.40
8o
0o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT370-1
REFERENCES
JEDEC
JEITA
MO-118
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 9. Package outline SOT370-1 (SSOP48)
74LVT_LVTH16244B_6
Product data sheet
Rev. 06 — 13 November 2008
© NXP B.V. 2008. All rights reserved.
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