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74HCT3G07DC View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
View to exact match
74HCT3G07DC
NXP
NXP Semiconductors. NXP
74HCT3G07DC Datasheet PDF : 13 Pages
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NXP Semiconductors
74HC3G07; 74HCT3G07
Triple buffer with open-drain outputs
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
y
Z
8
5
pin 1 index
E
c
HE
A A2
A1
1
e
4
bp
wM
detail X
A
X
vM A
Q
(A3)
θ
Lp
L
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
mm
1
0.15
0.00
0.85
0.60
0.12
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT765-1
REFERENCES
JEDEC
JEITA
MO-187
L
Lp
Q
v
w
y
Z(1)
θ
0.4
0.40 0.21
0.15 0.19
0.2
0.13
0.1
0.4
0.1
8°
0°
EUROPEAN
PROJECTION
ISSUE DATE
02-06-07
Fig 9. Package outline SOT765-1 (VSSOP8)
74HC_HCT3G07_2
Product data sheet
Rev. 02 — 12 May 2009
© NXP B.V. 2009. All rights reserved.
9 of 13
 

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