74HC08 View Datasheet(PDF) - ON Semiconductor
Part Name
Description
View to exact match
74HC08 Datasheet PDF : 7 Pages
| |||
74HC08
ÎÎMÎÎSAymXÎÎbIMolUÎÎM RÎÎATÎÎINGÎÎS ÎÎÎÎPaÎÎramÎÎeterÎÎÎÎÎÎÎÎÎÎÎÎÎÎVÎÎalueÎÎÎÎÎÎUnÎÎit
VCC DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
Vin DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5 V
Vout DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5 V
Iin
DC Input Current, per Pin
±20
mA
Iout DC Output Current, per Pin
±25
mA
ICC DC Supply Current, VCC and GND Pins
±50
mA
PD Power Dissipation in Still Air,
SOIC Package†
500
mW
TSSOP Package†
450
Tstg Storage Temperature
– 65 to + 150
_C
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
TL Lead Temperature, 1 mm from Case for 10 Seconds
_C
SOIC or TSSOP Package
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
†Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout DC Input Voltage, Output Voltage (Referenced to
0
VCC
V
GND)
TA
Operating Temperature Range, All Package Types – 55 + 125
_C
tr, tf
Input Rise/Fall Time
(Figure 1)
VCC = 2.0 V 0
VCC = 4.5 V 0
VCC = 6.0 V 0
1000
ns
500
400
ORDERING INFORMATION
Device
Package
Shipping†
74HC08DR2G
SOIC−14
(Pb−Free)
2500/Tape & Reel
74HC08DTR2G
TSSOP−14*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
http://onsemi.com
2
|
|
Share Link: 