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ICL3221CV View Datasheet(PDF) - Intersil

Part Name
Description
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ICL3221CV Datasheet PDF : 28 Pages
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ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
Ordering Information (Continued)
PART NUMBER (NOTE 1)
PART MARKING
TEMP. RANGE (°C)
PACKAGE
PKG. DWG. #
ICL3232CVZ (Note 2)
3232CVZ
0 to 70
16 Ld TSSOP (Pb-free)
M16.173
ICL3232IA
ICL3232IA
-40 to 85
16 Ld SSOP
M16.209
ICL3232IAZ (Note 2)
3232IAZ
-40 to 85
16 Ld SSOP (Pb-free)
M16.209
ICL3232IB
ICL3232IB
-40 to 85
16 Ld SOIC
M16.3
ICL3232IBZ (Note 2)
3232IBZ
-40 to 85
16 Ld SOIC (Pb-free)
M16.3
ICL3232IBN
3232IBN
-40 to 85
16 Ld SOIC (N)
M16.15
ICL3232IBNZ (Note 2)
3232IBNZ
-40 to 85
16 Ld SOIC (N) (Pb-free)
M16.15
ICL3232IV
ICL3232IV
-40 to 85
16 Ld TSSOP
M16.173
ICL3232IVZ (Note 2)
3232IVZ
-40 to 85
16 Ld TSSOP (Pb-free)
M16.173
ICL3241CA
ICL3241CA
0 to 70
28 Ld SSOP
M28.209
ICL3241CAZ (Note 2)
ICL3241CAZ
0 to 70
28 Ld SSOP (Pb-free)
M28.209
ICL3241CB
ICL3241CB
0 to 70
28 Ld SOIC
M28.3
ICL3241CBZ (Note 2)
ICL3241CBZ
0 to 70
28 Ld SOIC (Pb-free)
M28.3
ICL3241CV
ICL3241CV
0 to 70
28 Ld TSSOP
M28.173
ICL3241CVZ (Note 2)
ICL3241CVZ
0 to 70
28 Ld TSSOP (Pb-free)
M28.173
ICL3241IA
ICL3241IA
-40 to 85
28 Ld SSOP
M28.209
ICL3241IAZ (Note 2)
ICL3241IAZ
-40 to 85
28 Ld SSOP (Pb-free)
M28.209
ICL3241IB
ICL3241IB
-40 to 85
28 Ld SOIC
M28.3
ICL3241IBZ (Note 2)
ICL3241IBZ
-40 to 85
28 Ld SOIC (Pb-free)
M28.3
ICL3241IV
ICL3241IV
-40 to 85
28 Ld TSSOP
M28.173
ICL3241IVZ (Note 2)
ICL3241IVZ
-40 to 85
28 Ld TSSOP (Pb-free)
M28.173
ICL3243CA
ICL3243CA
0 to 70
28 Ld SSOP
M28.209
ICL3243CAZ (Note 2)
ICL3243CAZ
0 to 70
28 Ld SSOP (Pb-free)
M28.209
ICL3243CB
ICL3243CB
0 to 70
28 Ld SOIC
M28.3
ICL3243CBZ (Note 2)
ICL3243CBZ
0 to 70
28 Ld SOIC (Pb-free)
M28.3
ICL3243CV
ICL3243CV
0 to 70
28 Ld TSSOP
M28.173
ICL3243CVZ (Note 2)
ICL3243CVZ
0 to 70
28 Ld TSSOP (Pb-free)
M28.173
ICL3243IA
ICL3243IA
-40 to 85
28 Ld SSOP
M28.209
ICL3243IAZ (Note 2)
ICL3243IAZ
-40 to 85
28 Ld SSOP (Pb-free)
M28.209
*Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTES:
1. Most surface mount devices are available on tape and reel; add “-T” to suffix.
2. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3
FN4805.21
March 1, 2006
 

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