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ICL3221CA View Datasheet(PDF) - Intersil

Part NameDescriptionManufacturer
ICL3221CA 1 Microamp Supply-Current, +3V to +5.5V, 250kbps, RS-232 Transmitters/Receivers Intersil
Intersil Intersil
ICL3221CA Datasheet PDF : 28 Pages
First Prev 21 22 23 24 25 26 27 28
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
Thin Shrink Small Outline Plastic Packages (TSSOP)
N
INDEX
AREA
E
E1
-B-
0.25(0.010) M B M
GAUGE
PLANE
123
0.05(0.002) SEATING PLANE
-A-
D
A
L
0.25
0.010
-C-
α
e
A1
A2
c
b
0.10(0.004)
0.10(0.004) M C A M B S
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AE, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.047
-
1.20
-
A1
0.002 0.006
0.05
0.15
-
A2
0.031 0.051
0.80
1.05
-
b
0.0075 0.0118 0.19
0.30
9
c
0.0035 0.0079 0.09
0.20
-
D
0.378 0.386
9.60
9.80
3
E1
0.169 0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246 0.256
6.25
6.50
-
L
0.0177 0.0295 0.45
0.75
6
N
28
28
7
α
0o
8o
0o
8o
-
Rev. 0 6/98
26
FN4805.21
March 1, 2006
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