Q5962F9563003QXC View Datasheet(PDF) -
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HS-1840ARH, HS-1840BRH
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
-A-
-D-
E
-B-
bbb S C A - B S D S
c1 LEAD FINISH
BASE
METAL
(c)
b1
M
M
(b)
SECTION A-A
D
BASE
PLANE
SEATING
PLANE
S1
b2
b
AA
e
ccc M C A - B S D S
S2
Q
-C- A
L
eA
eA/2
c
aaa M C A - B S D S
NOTES:
4. Index area: A notch or a pin one identification mark shall be located
adjacent to pin one and shall be located within the shaded area
shown. The manufacturer’s identification shall not be used as a pin
one identification mark.
5. The maximum limits of lead dimensions b and c or M shall be mea-
sured at the centroid of the finished lead surfaces, when solder dip
or tin plate lead finish is applied.
6. Dimensions b1 and c1 apply to lead base metal only. Dimension M
applies to lead plating and finish thickness.
7. Corner leads (1, N, N/2, and N/2+1) may be configured with a par-
tial lead paddle. For this configuration dimension b3 replaces di-
mension b2.
8. Dimension Q shall be measured from the seating plane to the base
plane.
9. Measure dimension S1 at all four corners.
10. Measure dimension S2 from the top of the ceramic body to the
nearest metallization or lead.
11. N is the maximum number of terminal positions.
12. Braze fillets shall be concave.
13. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
14. Controlling dimension: INCH.
D28.6 MIL-STD-1835 CDIP2-T28 (D-10, CONFIGURATION C)
28 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.232
-
5.92
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
1.490
-
37.85
-
E
0.500
0.610 12.70
15.49
-
e
0.100 BSC
2.54 BSC
-
eA
0.600 BSC
15.24 BSC
-
eA/2
0.300 BSC
7.62 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
5
S1
0.005
-
0.13
-
6
S2
0.005
-
0.13
-
7
α
90o
105o
90o
105o
-
aaa
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2
N
28
28
8
Rev. 0 5/18/94
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6
FN4355.3
September 14, 2010
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