MC33888FB View Datasheet(PDF) - Freescale Semiconductor
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MC33888FB Datasheet PDF : 32 Pages
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Freescale Semiconductor, Inc.
MAXIMUM RATINGS (continued)
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Storage Temperature
Control Die Thermal Resistance (Note 9)
PQFP
One Low-Side ON
Two Low-Side ON
Three Low-Side ON
Four Low Side ON
All Low-Sides ON
PQFN
One Low-Side ON
Two Low-Side ON
Three Low-Side ON
Four Low Side ON
All Low-Sides ON
Power Die Thermal Resistance (Note 9)
PQFP
One High-Side 2, 3 ON
All High-Sides ON
PQFN
One High-Side 2, 3 ON
All High-Sides ON
Thermal Resistance, Junction to Ambient, Natural Convection, Four-Layer
Board (Note 9)
PQFP
PQFN
Peak Terminal Reflow Temperature During Solder Mounting (Note 10)
PQFP
PQFN
TA
TJ
TSTG
RθCJC
RθPJC
RθJA
TSOLDER
-40 to 125
-40 to 150
-55 to 150
12.5
9.3
7.3
5.9
3.2
8.6
6.0
4.6
3.8
2.0
0.5
0.15
0.5
0.1
33
37
225
240
°C
°C
°C/W
°C/W
°C/W
°C
Notes
9. Board dimensions are 8.0 cm x 8.0 cm x 1.5 mm with a 300 mm2 copper area on the bottom layer.
10. Terminal soldering temperature limit is 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
33888
10
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
For More Information On This Product,
Go to: www.freescale.com
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