MC33663ALEF View Datasheet(PDF) - Freescale Semiconductor

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Description

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MC33663ALEF

LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

Thermal Ratings

Operating Temperature

Ambient

Junction

C

TA

- 40 to 125

TJ

- 40 to 150

Storage Temperature

TSTG

- 40 to 150

C

Thermal Resistance, Junction to Ambient

Peak package reflow temperature during reflow(4),(5)

RJA

TPPRT

150

Note 5

°C/W

C

Thermal Shutdown Temperature

TSHUT

150 to 200

°C

Thermal Shutdown Hysteresis Temperature

THYST

20

°C

Notes

4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Table 4. Limits / Maximum test voltage for transient immunity tests

Test Pulse

VS [V]

Pulse repetition

frequency [Hz] (1/T1)

Test duration [min]

1

-100

2a

+75

2

1 for function test

2

10 for damage test

3a

-150

10

3b

+100

10

Ri []

10

2

50

50

Remarks

t2 = 0s

DUT

VSUP

DUT GND

D1

10 µF

Transient Pulse

Generator

(Note)

GND

Note Waveform per ISO 7637-2. Test Pulses 1, 2a, 3a, 3b

Figure 4. Test Circuit for Transient Test Pulses (VSUP)

33663

8

Analog Integrated Circuit Device Data

Freescale Semiconductor

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