datasheetbank_Logo     Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

24LC014T View Datasheet(PDF) - Microchip Technology

Part NameDescriptionManufacturer
24LC014T I2C? Serial EEPROM Family Data Sheet Microchip
Microchip Technology Microchip
24LC014T Datasheet PDF : 42 Pages
First Prev 31 32 33 34 35 36 37 38 39 40 Next Last
24AAXX/24LCXX/24FCXX
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
e
b
N
L
NOTE 1
12
TOP VIEW
K
E
EXPOSED PAD
E2
21
D2
BOTTOM VIEW
NOTE 1
A
A3
A1
NOTE 2
Number of Pins
Pitch
Overall Height
Units
Dimension Limits
N
e
A
MILLIMETERS
MIN
NOM
MAX
8
0.50 BSC
0.80
0.90
1.00
Standoff
Contact Thickness
Overall Length
A1
0.00
0.02
0.05
A3
0.20 REF
D
2.00 BSC
Overall Width
Exposed Pad Length
Exposed Pad Width
E
3.00 BSC
D2
1.30
1.75
E2
1.50
1.90
Contact Width
b
0.18
0.25
0.30
Contact Length
L
0.30
0.40
0.50
Notes:
Contact-to-Exposed Pad
K
0.20
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B
© 2007 Microchip Technology Inc.
DS21930B-page 31
Direct download click here

 

Share Link : 

All Rights Reserved © datasheetbank.com 2014 - 2020 [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]