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24LC014T 查看數據表(PDF) - Microchip Technology

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24LC014T I2C? Serial EEPROM Family Data Sheet Microchip
Microchip Technology Microchip
24LC014T Datasheet PDF : 42 Pages
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24AAXX/24LCXX/24FCXX
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1 23
D
E
A
A2
A1
L
c
e
b1
eB
b
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
.100 BSC
Top to Seating Plane
A
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.060
.070
Lower Lead Width
b
.014
.018
.022
Notes:
Overall Row Spacing §
eB
.430
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
DS21930B-page 29
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