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S2G View Datasheet(PDF) - Micro Commercial Components

Part Name
Description
View to exact match
S2G
MCC
Micro Commercial Components MCC
S2G Datasheet PDF : 4 Pages
1 2 3 4
NOT RECOMMENDED FOR NEW DESIGNS
USE S2A-LTP~S2M-LTP SERIES
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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Features
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
For Surface Mount Applications
Low Thermal Resistance
Easy Pick And Place
High Temp Soldering: 260°C for 10 Seconds At Terminals
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Power Dissipation : 2.35W
Maximum Ratings
Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
Thermal Resistance; 16 °C/W Junction To Lead
53°C/W Junction To Ambient
MCC
Catalog
Number
Device
Marking
Maximum
Recurrent
Peak Reverse
Voltage
Maximum
RMS
Voltage
S2A
S2A
50V
35V
S2B
S2B
100V
70V
S2D
S2D
200V
140V
S2G
S2J
S2G
S2J
400V
600V
280V
420V
S2K
S2K
800V
560V
S2M
S2M
1000V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
current
IF(AV)
2.0A TJ = 75°C
Peak Forward Surge IFSM
Current
Maximum
Instantaneous
VF
Forward Voltage
50A
1.15V
8.3ms, half sine,
TJ = 150°C
IFM = 2.0A;
TJ = 25°C*
Maximum DC
Reverse Current At
IR
10µA TJ = 25°C
Rated DC Blocking
50µA TJ = 125°C
Voltage
Maximum Reverse
Trr
2.0µs IF=0.5A, IR=1.0A,
Recovery Time
Irr=0.25A
Typical Junction
Capacitance
CJ
30pF Measured at
1.0MHz, VR=4.0V
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
S2A
THRU
S2M
2 Amp
Silicon Rectifier
50 to 1000 Volts
DO-214AA
(HSMB) (Round Lead)
H
Cathode Band
J
A
C
E
D
F
G
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.078
.116
B
.075
.089
C
.002
.008
D
-----
.02
E
.035
.055
F
.065
.091
G
.205
.224
H
.160
.180
J
.130
.155
MM
MIN
1.98
1.90
.05
-----
.90
1.65
5.21
4.06
3.30
B
MAX
2.95
2.25
.20
.51
1.40
2.32
5.69
4.57
3.94
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090"
0.085”
0.070”
Revision: C
www.mccsemi.com
1 of 4
2013/12/27
 

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