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OP470GPZ View Datasheet(PDF) - Analog Devices

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Description
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OP470GPZ Datasheet PDF : 17 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ABSOLUTE MAXIMUM RATINGS1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Differential Input Voltage2 . . . . . . . . . . . . . . . . . . . . . . ± 1.0 V
Differential Input Current2 . . . . . . . . . . . . . . . . . . . . ± 25 mA
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage
Output Short-Circuit Duration . . . . . . . . . . . . . . . Continuous
Storage Temperature Range
P, Y Package . . . . . . . . . . . . . . . . . . . . . . –65C to +150C
Lead Temperature Range (Soldering 60 sec) . . . . . . . . . 300C
Junction Temperature (Tj) . . . . . . . . . . . . . –65C to +150C
Operating Temperature Range
OP470A . . . . . . . . . . . . . . . . . . . . . . . . . –55C to +125C
OP470E, OP470F . . . . . . . . . . . . . . . . . . . –25C to +85C
OP470G . . . . . . . . . . . . . . . . . . . . . . . . . . –40C to +85C
ORDERING GUIDE
TA = 25C
VOS max
(V)
Package Options
Cerdip
14-Pin
Plastic
Operating
Temperature
Range
400
400
400
800
1000
1000
OP470AY*
OP470EY
OP470FY*
OP470GP
OP470GS
MIL
MIL
IND
IND
XIND
XIND
*Not for new design; obsolete April 2002.
For military processed devices, please refer to the standard
Microcircuit Drawing (SMD) available at
www.dscc.dla.mil/programs/milspec/default.asp
SMD Part Number
59628856501CA
596288565012A
596288565013A*
*Not for new designs; obsolete April 2002.
ADI Equivalent
OP470AYMDA
OP470ARCMDA
OP470ATCMDA
OP470
Package Type
JA3
JC
Unit
14-Lead Hermetic DIP(Y) 94
10
C/W
14-Lead Plastic DIP(P) 76
33
C/W
16-Lead SOIC (S)
88
23
C/W
NOTES
1Absolute Maximum Ratings apply to both DICE and packaged parts, unless
otherwise noted.
2The OP470’s inputs are protected by back-to-back diodes. Current limiting
resistors are not used in order to achieve low noise performance. If differential
voltage exceeds ± 1.0 V, the input current should be limited to ± 25 mA.
3JA is specified for worst case mounting conditions, i.e., JA is specified for device
in socket for TO, CerDIP, PDIP, packages; JA is specified for device soldered to
printed circuit board for SOIC packages.
+IN B
V+
+IN A
–IN B
–IN A
OUT B
OUT A
OUT C
–IN C +IN C
V–
+IN D
DIE SIZE 0.163 ؋ 0.106 INCH, 17,278 SQ. mm
(4.14 ؋ 2.69 mm, 11.14 SQ. mm)
Figure 1. Dice Characteristics
OUT D
–IN D
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the OP470 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. B
–5–
 

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