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LMH0303SQX/NOPB View Datasheet(PDF) - Texas Instruments

Part NameDescriptionManufacturer
LMH0303SQX/NOPB 3-Gbps HD/SD SDI Cable Driver With Cable Detect TI
Texas Instruments TI
LMH0303SQX/NOPB Datasheet PDF : 27 Pages
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www.ti.com
6 Specifications
LMH0303
SNLS285H – APRIL 2008 – REVISED MAY 2016
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
Supply voltage
Input voltage (all inputs)
Output current
Lead temperature (soldering, 4 s)
Junction temperature
Storage temperature, Tstg
MIN
MAX
UNIT
–0.5
3.6
V
–0.3
VCC + 0.3
V
28
mA
260
°C
125
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
Machine model (MM)
VALUE
±8000
±2000
±400
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as
±8000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as
±2000 V may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage (VCC – VEE)
Operating junction temperature
Operating free air temperature, TA
MIN
NOM
3.13
3.3
–40
25
MAX
3.46
100
85
UNIT
V
°C
°C
6.4 Thermal Information
THERMAL METRIC(1)
LMH0303
RUM (WQFN)
UNIT
16 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
40.7
°C/W
39.5
°C/W
18.5
°C/W
0.6
°C/W
18.5
°C/W
8
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2008–2016, Texas Instruments Incorporated
Product Folder Links: LMH0303
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