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BQ24153 View Datasheet(PDF) - Texas Instruments

Part NameDescriptionManufacturer
BQ24153 Fully Integrated Switch-Mode One-Cell Li-Ion Charger With Full USB Compliance and USB-OTG Support TI
Texas Instruments TI
BQ24153 Datasheet PDF : 41 Pages
First Prev 31 32 33 34 35 36 37 38 39 40
www.ti.com
bq24153
bq24156, bq24158
SLUSA27 – MARCH 2010
Battery Charge Efficiency
90
TA=25°C,
89
TOKO
VBUS = 5 V,
88
FDK VBAT = 3 V
87
muRata
86
Inter-Technical
85
84
83
82
500 600 700 800 900 1000 1100 1200 1300
Charge Current - mA
Battery Charge Loss
800
TA=25°C,
700 VBUS = 5 V,
VBAT = 3 V
600
500
Inter-Technical
400
muRata
300
TOKO
FDK
200
100
500 600 700 800 900 1000 1100 1200 1300
Charge Current - mA
Figure 37. Measured Efficiency and Power Loss
PCB LAYOUT CONSIDERATION
It is important to pay special attention to the PCB layout. The following provides some guidelines:
• To obtain optimal performance, the power input capacitors, connected from input to PGND, should be placed
as close as possible to the bqTINYSWITCHER. The output inductor should be placed close to the IC and the
output capacitor connected between the inductor and PGND of the IC. The intent is to minimize the current
path loop area from the SW pin through the LC filter and back to the PGND pin. To prevent high frequency
oscillation problems, proper layout to minimize high frequency current path loop is critical. (See Figure 38.)
The sense resistor should be adjacent to the junction of the inductor and output capacitor. Route the sense
leads connected across the RSNS back to the IC, close to each other (minimize loop area) or on top of each
other on adjacent layers (do not route the sense leads through a high-current path). (See Figure 39.)
• Place all decoupling capacitor close to their respective IC pin and as close as to PGND (do not place
components such that routing interrupts power stage currents). All small control signals should be routed
away from the high current paths.
• The PCB should have a ground plane (return) connected directly to the return of all components through vias
(two vias per capacitor for power-stage capacitors, two vias for the IC PGND, one via per capacitor for
small-signal components). A star ground design approach is typically used to keep circuit block currents
isolated (high-power/low-power small-signal) which reduces noise-coupling and ground-bounce issues. A
single ground plane for this design gives good results. With this small layout and a single ground plane, there
is no ground-bounce issue, and having the components segregated minimizes coupling between signals.
• The high-current charge paths into VBUS, PMID and from the SW pins must be sized appropriately for the
maximum charge current in order to avoid voltage drops in these traces. The PGND pins should be
connected to the ground plane to return current through the internal low-side FET.
• Place 4.7mF input capacitor as close to PMID pin and PGND pin as possible to make high frequency current
loop area as small as possible. Place 1mF input capacitor as close to VBUS pin and PGND pin as possible to
make high frequency current loop area as small as possible (see Figure 40).
Copyright © 2010, Texas Instruments Incorporated
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