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VCA810 データシートの表示(PDF) - Texas Instruments

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VCA810 High Gain Adjust Range, Wideband and Variable Gain Amplifier Texas-Instruments
Texas Instruments Texas-Instruments
VCA810 Datasheet PDF : 40 Pages
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VCA810
SBOS275G – JUNE 2003 – REVISED DECEMBER 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
Over operating free-air temperature range, unless otherwise noted.(1)
Power supply
Internal power dissipation
Differential input voltage
Input common-mode voltage
Junction temperature, TJ
Storage temperature, Tstg
MIN
MAX
±6.5
See Thermal Information
±VS
±VS
150
–65
125
UNIT
V
V
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-
C101 (2)
Machine Model (MM)
VALUE
±2000
±1500
±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Temperature
Supply voltage
MIN
NOM
MAX UNIT
–40
25
85
°C
±4
±5
±5.5
V
7.4 Thermal Information
THERMAL METRIC(1)
VCA810
D (SOIC)
UNIT
8 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
80
°C/W
51
°C/W
45
°C/W
14
°C/W
45
°C/W
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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