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CX1084-ADJ View Datasheet(PDF) - Unspecified

Part NameDescriptionManufacturer
CX1084-ADJ 5A Low Dropout Voltage Regulator ETC2
Unspecified 
CX1084-ADJ Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
SPECIFICATION
resistance between the regulator and the load would be:
RP x( R2+R1 )/ R1
RP = Parasitic Line Resistance
Connected as shown below,RP is not multiplied by the
divider ratio. Using 16-gauge wire the parasitic line
resistance is about 0.004 per foot, translating to 4mV/ft at
1A load current. It is important to keep the positive lead
between regulator and load as short as possible and use
large wire or PC board traces.
VIN
CX1084
IN OUT
ADJ
Rp
R1*
RL
R2*
Thermal Considerations
The CX1084 series have internal power and thermal limiting
circuitry designed to protect the device under overload
conditions. However maximum junction temperature ratings
should not be exceeded under continuous normal load
conditions. Careful consideration must be given to all
sources of thermal resistance from junction to ambient,
including junction-to-case, case-to-heat sink interface and
heat sink resistance itself. To ensure safe operating
temperatures and reflect more accurately the device
temperature, new thermal resistance specifications
have been developed. Unlike older regulators with a single
circuitry designed to protect the device under overload
CX1084
junction-to-case thermal resistance specification, the data
section for these new regulators provides a separate
thermal resistance and maximum junction temperature for
both the Control Section and the Power Transistor.
Calculations for both temperatures under certain conditions
of ambient temperature and heat sink resistance and to
ensure that both thermal limits are met.
Thermal Considerations
The CX1084 series have internal power and thermal limiting
circuitry designed to protect the device under overload
conditions. However maximum junction temperature ratings
should not be exceeded under continuous normal load
conditions. Careful consideration must be given to all
sources of thermal resistance from junction to ambient,
including junction-to-case, case-to-heat sink interface and
heat sink resistance itself. To ensure safe operating
temperatures and reflect more accurately the device
temperature, new thermal resistance specifications
have been developed. Unlike older regulators with a single
junction-to-case thermal resistance specification, the data
section for these new regulators provides a separate
thermal resistance and maximum junction temperature for
both the Control Section and the Power Transistor.
Calculations for both temperatures under certain conditions
of ambient temperature and heat sink resistance and to
ensure that both thermal limits are met.
Junction-to-case thermal resistance is specified from the IC
junction to the bottom of the case directly below the die.
This is the lowest resistance path for the heat flow. In order
to ensure the best possible thermal flow from this area of
the package to the heat sink proper mounting is required.
Thermal compound at the case-to-heat sink interface is
recommended. A thermally conductive spacer can be used,
if the case of the device must be electrically isolated, but its
added contribution to thermal resistance has to be
considered.
Page 6 of 6
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