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M93C06-BN3 View Datasheet(PDF) - STMicroelectronics

Part NameDescriptionManufacturer
M93C06-BN3 16Kbit, 8Kbit, 4Kbit, 2Kbit, 1Kbit and 256bit (8-bit or 16-bit wide) MICROWIRE Serial Access EEPROM ST-Microelectronics
STMicroelectronics ST-Microelectronics
M93C06-BN3 Datasheet PDF : 30 Pages
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M93C86, M93C76, M93C66, M93C56, M93C46, M93C06
MAXIMUM RATING
Stressing the device above the rating listed in the
Absolute Maximum Ratings" table may cause per-
manent damage to the device. These are stress
ratings only and operation of the device at these or
any other conditions above those indicated in the
Operating sections of this specification is not im-
plied. Exposure to Absolute Maximum Rating con-
ditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics
SURE Program and other relevant quality docu-
ments.
Table 7. Absolute Maximum Ratings
Symbol
Parameter
Min.
TSTG Storage Temperature
–65
TLEAD Lead Temperature during Soldering 1
PDIP
SO
TSSOP
VOUT Output range (Q = VOH or Hi-Z)
–0.45
VIN Input range
–0.45
VCC Supply Voltage
–0.3
VESD Electrostatic Discharge Voltage (Human Body model) 4
–4000
Note: 1. Compliant with the ECOPACK® 7191395 specifiication for lead-free soldering processes
2. No longer than 10 seconds
3. Not exceeding 250°C for more than 30 seconds, and peaking at 260°C
4. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 , R2=500 )
Max.
150
260 2
260 3
260 3
VCC+0.5
VCC+1
6.5
4000
Unit
°C
°C
V
V
V
V
12/30
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