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STQ2NF06L View Datasheet(PDF) - STMicroelectronics

Part Name
Description
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STQ2NF06L Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
STQ2NF06L
THERMAL DATA
Rthj-lead Thermal Resistance Junction-Lead
Max
40
Rthj-amb Thermal Resistance Junction-ambient
Max
125
Tl
Maximum Lead Temperature For Soldering Purpose
Typ
260
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
60
V
Breakdown Voltage
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
1
µA
10
µA
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 16 V
±100
nA
ON (*)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
VGS = 5 V
ID = 1 A
ID = 1 A
Min.
1
Typ.
0.1
0.12
Max.
0.12
0.14
Unit
V
DYNAMIC
Symbol
gfs (*)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 15 V
ID = 1 A
VDS = 25V f = 1 MHz VGS = 0
Min.
Typ.
3
360
55
25
Max.
Unit
S
pF
pF
pF
2/9
 

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