NCV47710 View Datasheet(PDF) - ON Semiconductor
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NCV47710
ON Semiconductor
NCV47710 Datasheet PDF : 12 Pages
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NCV47710
PACKAGE DIMENSIONS
SOIC−8 EP
CASE 751AC
ISSUE C
NOTE 5
NOTE 4
D
0.10 C D
45 5 CHAMFER
h
H
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
DA
q
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.004mm IN
EXCESS OF MAXIMUM MATERIAL CONDITION.
8
5
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRU-
SIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
E ÍÍÍÍ
E1 NOTE 4
L
(L1)
GATE BURRS SHALL NOT EXCEED 0.006mm PER SIDE.
C
SEATING
PLANE
DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.010mm PER SIDE.
5. DATUMS A AND B TO BE DETERMINED AT DATUM PLANE H.
0.10 C D
DETAIL A
MILLIMETERS
0.20 C D
1
PIN ONE
LOCATION
B
4
8X b
0.25 C A-B D
DIM MIN
A 1.35
A1 −−−
A2 1.35
MAX
1.75
0.10
1.65
NOTE 5
TOP VIEW
NOTES 3
b 0.31 0.51
b1 0.28 0.48
c 0.17 0.25
0.10 C
DETAIL A
A2
0.10 C
A
NOTE 7
c
c1 0.17 0.23
D
4.90 BSC
E
6.00 BSC
E1 3.90 BSC
e
1.27 BSC
A
A1
e
SIDE VIEW
C
SEATING
PLANE
A
END VIEW
F 2.24 3.20
G 1.55 2.51
h 0.25 0.50
L 0.40 1.27
L1 1.04 REF
F
q
0 _ 8_
1
4
G
c ÉÉÇÇ(bÉÉÇÇb1) ÉÉÇÇ c1
8
5
BOTTOM VIEW
SECTION A−A
RECOMMENDED
SOLDERING FOOTPRINT*
3.20
8X
1.52
2.51 7.00
1
1.27
PITCH
8X
0.76
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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