datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

ISB35000 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
View to exact match
ISB35000
ST-Microelectronics
STMicroelectronics ST-Microelectronics
ISB35000 Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ISB35000 SERIES
PACKAGE AVAILABILITY
The ISB28000 Series is designed to be compatible
with QFP, BGA and SBC package types, in addition
to the more traditional types found.
The options include Plastic Leaded Chip Carriers
(PLCC) from 28 to 84 pins, while the Metric Quad
Flat Pack (xQFP) offering ranges up to 304 pins.
Both high performance and high power variants are
available as well as the TQFP thin types.
Ball Grid Array (BGA) packages are available from
160 to 500 pins and SBC types allow the pin count
to reach the area of 1000 pins.
Pin counts for through board mounting range up to
299. For higher pin counts the range is compatible
with the industry standard JEDEC and EIA-J Guar-
dring Quad Flatpack (GQPF) with pin counts from
186 to 304.
The diversity in pin count and package style gives
the designer the opportunity to find the best com-
promise for system size, cost and performance
requirements.
All packages for the military market are hermetically
sealed to meet MIL-STD-883 Method. Prototypes
are developed in ceramic packages for fast turn-
around evaluation.
Figure 6. Packaging Capability
Guardring Quad GQFP
208 304
44
304
Plastic Quad Flatpack
44
Thin Quad Flatpack
BGA and HP BGA
144
225
44 84
Plastic Chip Carrier
64
Pin Grid Array
Power QFP Spreader
80
304
and Slug based
0 100 200 300 400
PIN COUNT
Lead Pitch
0.5mm
0.5&0.65 mm
0.5mm
700+
Large
Large
447
Large
0.5&0.65 mm
500 600 700
NOW
PLANNED
ISB35_VB
10/15
 

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]