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MC74LVX00 View Datasheet(PDF) - ON Semiconductor

Part NameDescriptionManufacturer
MC74LVX00 Quad 2-Input NAND Gate With 5 V−Tolerant Inputs ONSEMI
ON Semiconductor ONSEMI
MC74LVX00 Datasheet PDF : 5 Pages
1 2 3 4 5
MC74LVX00
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
0.15 (0.006) T U S
2X L/2 14
L
PIN 1
IDENT.
1
14X K REF
0.10 (0.004) M T U S V S
N
0.25 (0.010)
8
M
B
−U− N
F
7
DETAIL E
0.15 (0.006) T U S
A
−V−
J J1 ÇÇÇÉÉÇÇÇÉÉKK1ÇÇÇÉÉ
SECTION N−N
C
0.10 (0.004)
−T− SEATING
PLANE
D
G
H
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
−W−
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0_ 8_ 0_ 8_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
4
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