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ISL71090SEHF25 View Datasheet(PDF) - Intersil

Part Name
Description
View to exact match
ISL71090SEHF25 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
ISL71090SEH25
Package Characteristics
Weight of Packaged Device
0. 31 Grams (Typical)
Lid Characteristics
Finish: Gold
Potential: Connected to pin #4 (GND)
Case Isolation to Any Lead: 20 x 109 (min)
Die Characteristics
Die Dimensions
1464µm x 1744µm (58mils x 69mils)
Thickness: 483µm ± 25µm (19mils ± 1 mil)
Interface Materials
GLASSIVATION
Type: Nitrox
Thickness: 15kÅ
Metallization Mask Layout
TOP METALLIZATION
Type: AlCu (99.5%/0.5%)
Thickness: 30kÅ
BACKSIDE FINISH
Silicon
ASSEMBLY RELATED INFORMATION
SUBSTRATE POTENTIAL
Floating
ADDITIONAL INFORMATION
WORST CASE CURRENT DENSITY
<2 x 105 A/cm2
PROCESS
Dielectrically Isolated Advanced Bipolar Technology- PR40
DNC
DNC
VS
DNC
COMP
VOUT
SENSE
GND
POWR
GND
QUIET
(see Note 12, Table 3)
8
TRIM
VOUT
FORCE
FN8451.0
June 6, 2013
 

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