AT25256 View Datasheet(PDF) - Atmel Corporation

Part Name

Description

View to exact match

AT25256

SPI Serial EEPROMs

Atmel Corporation 

20A2 – TSSOP

b

E E1

AT25128/256

L

L1

End View

e

Top View

SYMBOL

COMMON DIMENSIONS

(Unit of Measure = mm)

MIN NOM MAX

NOTE

D

6.40 6.50 6.60 2, 5

A

D

A2

E

6.40 BSC

E1

4.30 4.40 4.50 3, 5

A

–

–

1.20

A2

0.80 1.00 1.05

b

0.19

–

0.30

4

e

0.65 BSC

Side View

L

0.45 0.60 0.75

L1

1.00 REF

Notes:

1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation AC, for additional

information.

2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall

not exceed 0.15 mm (0.006 in) per side.

3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed

0.25 mm (0.010 in) per side.

4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess

of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.

Minimum space between protrusion and adjacent lead is 0.07 mm.

5. Dimension D and E1 to be determined at Datum Plane H.

6/3/02

2325 Orchard Parkway

R San Jose, CA 95131

TITLE

20A2, 20-lead (4.4 x 6.5 mm Body), 0.65 pitch,

Thin Shrink Small Outline Package (TSSOP)

DRAWING NO. REV.

20A2

C

21

0872O–SEEPR–03/05

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