ADC0808S125HW View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
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ADC0808S125HW Datasheet PDF : 23 Pages
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NXP Semiconductors
13. Package outline
ADC0808S125/250
Single 8-bit ADC, up to 125 MHz or 250 MHz
HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads;
body 7 x 7 x 1 mm; exposed die pad
SOT545-2
y
exposed die pad side
Dh
36
37
c
X
25
A
24 Z E
Eh
48
1
e
pin 1 index
wM
bp
D
HD
e
E HE
wM
bp
13
12
ZD
vM A
B
vM B
A A2 A1
detail X
(A 3)
θ
Lp
L
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT max. A1 A2 A3 bp
c D(1) Dh E(1) Eh
e
HD HE
mm
1.2
0.15
0.05
1.05
0.95
0.25
0.27
0.17
0.20
0.09
7.1
6.9
4.6
4.4
7.1
6.9
4.6
4.4
0.5
9.1
8.9
9.1
8.9
L Lp
v
w
y ZD(1) ZE(1) θ
1
0.75
0.45
0.2
0.08 0.08
0.9
0.6
0.9
0.6
7°
0°
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT545-2
REFERENCES
JEDEC
JEITA
MS-026
EUROPEAN
PROJECTION
ISSUE DATE
03-04-07
04-01-29
Fig 12. Package outline SOT545-2 (HTQFP48)
ADC0808S125_ADC0808S250_3
Product data sheet
Rev. 03 — 24 February 2009
© NXP B.V. 2009. All rights reserved.
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