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54AC139 View Datasheet(PDF) - STMicroelectronics

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54AC139 Datasheet PDF : 28 Pages
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Package mechanical data
Figure 6. Ceramic DSCC Flat-20 package outline
H
E
$
4
/

(

/
(

(

(
Note:
6
F
'
The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the
package. Connecting unused pins or metal lid to ground or to the power supply will not affect
the electrical characteristics.
Table 10. Ceramic DSCC Flat-20 package mechanical data
Symbol
Min.
Dimensions (mm)
Typ.
A
1.91
b
0.38
c
0.076
D
12.83
E
6.99
E2
5.05
5.21
E3
0.95
e
1.14
L
6.35
Q
0.25
S1
0.55
Max.
2.21
0.48
0.152
13.08
7.24
5.36
1.40
9.39
Doc ID 17352 Rev 3
15/28
 

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