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54ACT08 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
54ACT08 Datasheet PDF : 28 Pages
54ACxxxx, 54ACTxxxx
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 2. Ceramic Flat-14 package outline
F
G
D
Note:
H
14
A
1
H
8
N
L
7
E
M
B
C
016029E
The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the
package. Connecting unused pins or metal lid to ground or to the power supply will not affect
the electrical characteristics.
Table 6. Ceramic Flat-14 package mechanical data
Symbol
Min.
Dimensions (mm)
Typ.
A
6.75
6.91
B
9.76
9.95
C
1.49
D
0.10
0.127
E
7.50
7.62
F
1.27
G
0.38
0.43
H
6.0
L
18.75
M
0.38
N
4.31
Max.
7.06
10.14
1.95
0.15
7.75
0.48
22.0
Doc ID 17352 Rev 3
11/28
 

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