FS6070-01 View Datasheet(PDF) - AMI Semiconductor
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FS6070-01 Datasheet PDF : 7 Pages
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FS6070-01
1:4 HSTL to LVTTL Fanout Buffer IC
Preliminary Information
AMERICAN MICROSYSTEMS, INC.
October 2000
4.0 Package Information
Table 10: 16-pin TSSOP (4.4mm) Package Dimensions
DIMENSIONS
INCHES
MILLIMETERS
MIN. MAX. MIN. MAX.
A
-
0.0472
A1 0.002 0.006
A2 0.0315 0.041
b 0.0075 0.0118
c 0.0035 0.0079
D 0.193 0.201
E
0.252 BSC
E1 0.169 0.177
e
0.0256 BSC
S 0.0079
-
L 0.0177 0.0295
θ1
0°
8°
θ2
12° REF
θ3
12° REF
-
1.20
0.05 0.15
0.80 1.05
0.19 0.30
0.09 0.20
4.90 5.10
6.40 BSC
4.30 4.50
0.65 BSC
0.20
-
0.45 0.75
0°
8°
12° REF
12° REF
16
AMERICAN MICROSYSTEMS, INC.
E1 E
1
b
e
A2 A
S
c
D
A1
L
BASE PLANE
SEATING PLANE
θ2
θ3
θ1
Table 11: 16-pin TSSOP (4.4mm) Package Characteristics
PARAMETER
Thermal Impedance, Junction to Free-Air
Lead Inductance, Self
Lead Inductance, Mutual
Lead Capacitance, Bulk
Lead Capacitance, Mutual
SYMBOL
θJA
L11
L12
L13
C11
C12
C13
CONDITIONS/DESCRIPTION
Air flow = 0 m/s
Corner lead plus wire
Center lead plus wire
Corner lead plus wire, to first adjacent lead
Center lead plus wire, to first adjacent lead
Corner lead plus wire, to next adjacent lead
Center lead plus wire, to next adjacent lead
Any corner lead plus wire to VSS
Any center lead plus wire to VSS
Any corner lead plus wire to first adjacent lead
Any center lead plus wire to first adjacent lead
Any corner lead plus wire to next adjacent lead
Any center lead plus wire to next adjacent lead
TYP.
89
2.361
1.443
0.754
0.367
0.293
0.249
0.375
0.254
0.137
0.053
0.008
0.006
UNITS
°C/W
nH
nH
pF
pF
ISO9001
QS9000
6
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