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DF9B-09S-1V View Datasheet(PDF) - HIROSE ELECTRIC

Part Name
Description
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DF9B-09S-1V Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
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BPrecautions for Use
1. Recommended Temperature Profile (SMT)
Temperature (ç)
250
200
150 150ç
100
250ç
220ç
180ç
60sec max
Soldering
90~120sec
Preheating
50
Room temperature
0
50
100
150
200
250
300
Time (sec.)
2. Recommended Manual Soldering Condition (SMT)
3. Recommended Screen Thickness (SMT)
4. Board Warp(SMT)
5. Cleaning Condition
6. Cautions
Note1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that
there is a return to normal temperature between the first and second cycle.
Note2: The temperature profile indicates the board surface temperature at the point of contacts
with the connector terminals.
Soldering iron temperature: 370±10ç, Soldering time: Within 3 seconds
0.15mm
Maximum 0.03mm in the connector center area, based on both connector edges.
Refer to the "Nylon Connector Use Hand book".
s Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
s Where the board is not mounted, the insertion or extraction will cause damage or deformation in contacts.
s Excessive scoop insertion or extraction may result in damage.
s In the manual soldering process, don't carry out flux coating which will cause a flux blister on the connector.
s The color phase of this product may be slightly different from that of the forming product according to the
manufacturing lot. However, the difference doesn't affect the performance.
A142
 

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