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OB3362RP View Datasheet(PDF) - Unspecified

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OB3362RP Datasheet PDF : 13 Pages
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OB3362F
4 Channels High Performance LED Driver
Thermal Shutdown
pulse current. It must be as small as possible
The OB3362F includes a thermal protection circuit.
Use wide and short trace for connecting the
When the junction temperature exceeds 165°C
(typical), the controller and current sources shut
down and do not restart until the junction
temperature drops below 145°C (typical).
boost switching componentsinductor (L1),
external MOSFET (Q1), output diode (D1),and
output capacitor(C2) .
2) Connect a separate signal ground trace to
Layout Consideration
Careful attention must be paid to the PCB board
layout and components placement. Proper layout
of the high frequency switching path is critical to
3)
AGND pin, a separate power ground trace to
PGND pin, and then tie them together at input
T GND pin.
Place the Vcc filter capacitor (C3), R3 (RI
V resistor), C7 (CMP capacitor), C6 (BF/DMOD
I capacitor), and R4 (ISET resistor) as close to
prevent noise and electromagnetic interference
problems. Using the following guidelines for good
PCB layout:
1) The loop of L1D1C2GND and
4)
the IC as possible
The IC(ESOP16) exposed pad is internally
o connected to AGND pin ,OB3362F have a
t good thermal path to ambient to dissipate heat
L1Q1GND is flowing with high frequency
by connecting this pad to AGND trace
tial L1
en Q1
dD1
Confi C2
CCC333CCC777
RRR333RRR444CCC666
On-BrightPGND AGND
©On-Bright Electronics
Confidential
-9-
Preliminary Datasheet
OB_DOC_DS_3362F00
 

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