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SFR16S0001001JR500 View Datasheet(PDF) - Vishay Semiconductors

Part Name
Description
View to exact match
SFR16S0001001JR500
Vishay
Vishay Semiconductors Vishay
SFR16S0001001JR500 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
www.vishay.com
SFR16S, SFR25, SFR25H
Vishay BCcomponents
TESTS PROCEDURES AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
• EN 60115-1, generic specification (includes tests)
The test and requirements table contains only the most
important tests. For the full test schedule refer to the
documents listed above.
The tests are carried out in accordance with IEC 60068-2-xx
test method and under standard atmospheric conditions in
accordance with IEC 60068-1, 5.3.
Unless otherwise specified the following values apply:
• Temperature: 15 °C to 35 °C
• Relative humidity: 45 % to 75 %
• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
For performing some of the tests, the components are
mounted on a test board in accordance with IEC 60115-1,
4.31. In test procedures and requirements table, only the
tests and requirements are listed with reference to the
relevant clauses of IEC 60115-1 and IEC 60068-2-xx test
methods. A short description of the test procedure is also
given.
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
4.5
-
Resistance
-
4.8
-
Temperature
coefficient
At (20 / -55 / 20) °C
and (20 / 155 / 20) °C
4.12
-
Noise
IEC 60195
4.13
4.16
4.17
4.18
4.19
4.20
4.22
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
-
21 (Ua1)
21 (Ub)
21 (Uc)
20 (Ta)
20 (Tb)
14 (Na)
29 (Eb)
6 (Fc)
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
Short time
overload
Room temperature;
P = 6.25 x Pn;
(voltage not more than 2 x
limiting voltage); 5 s
Robustness of
terminations
Tensile, bending, and torsion
Solderability
Resistance to
soldering heat
Rapid change of
temperature
Bump
Vibration
Climatic
sequence:
Dry heat
Damp heat,
cyclic
Cold
Low air pressure
Damp heat,
cyclic
DC load
at +235 °C; 2 s;
solder bath method;
SnPb40
at +245 °C; 3 s;
solder bath method;
SnAg3Cu0.5
Unmounted components
(260 ± 5) °C; (10 ± 1) s
30 min at -55 °C and
30 min at +155 °C;
5 cycles
3 x 1500 bumps in 3 directions;
40 g
10 sweep cycles per direction;
10 Hz to 2000 Hz
1.5 mm or 200 m/s2
155 °C; 16 h
55 °C; 24 h;
90 % to 100 % RH; 1 cycle
-55 °C; 2 h
8.5 kPa; 2 h; 15 °C to 35 °C
55 °C; 5 days;
95 % to 100 % RH; 5 cycles
apply rated power for 1 min
REQUIREMENTS PERMISSIBLE CHANGE (Rmax.)
± 5 %; ± 1 %
± 250 ppm/K; ± 100 ppm/K
SFR16S
SFR25,
SFR25H
< 68 k
≤ 0.1 μV/V
≤ 0.1 μV/V
68 kto
100 k
≤ 0.5 μV/V
≤ 0.1 μV/V
> 100 kto
1 M
≤ 1.5 μV/V
≤ 0.1 μV/V
> 1 M
≤ 1.5 μV/V
≤ 1.5 μV/V
± (0.25 % R + 0.05 )
± (0.25 % R + 0.05 )
Good tinning (≥ 95 % covered); no damage
± (0.25 % R + 0.05 )
± (0.25 % R + 0.05 )
± (0.25 % R + 0.05 ); no damage
± (0.25 % R + 0.05 ); no damage
SFR16S,
SFR25,
SFR25H
± (1 % R + 0.05 ); no visible damage
± (1 % R + 0.05 ); no visible damage
± 2 % R; no visible damage
Revision: 12-Aug-16
7
Document Number: 28722
For technical questions, contact: filmresistorsleaded@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 

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