datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

FDS4435BZ_07 View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
FDS4435BZ_07
Fairchild
Fairchild Semiconductor Fairchild
FDS4435BZ_07 Datasheet PDF : 6 Pages
1 2 3 4 5 6
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
BVDSS
TJ
IDSS
IGSS
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
ID = -250µA, VGS = 0V
-30
ID = -250µA, referenced to 25°C
-21
VDS = -24V, VGS = 0V
VGS = ±25V, VDS = 0V
V
mV/°C
1
µA
±10
µA
On Characteristics
VGS(th)
VGS(th)
TJ
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage
Temperature Coefficient
rDS(on)
Static Drain to Source On Resistance
gFS
Forward Transconductance
VGS = VDS, ID = -250µA
-1
-2.1
ID = -250µA, referenced to 25°C
6
VGS = -10V, ID = -8.8A
16
VGS = -4.5V, ID = -6.7A
26
VGS = -10V, ID = -8.8A, TJ = 125°C
22
VDS = -5V, ID = -8.8A
24
-3
V
mV/°C
20
35
m
28
S
Dynamic Characteristics
Ciss
Coss
Crss
Rg
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
VDS = -15V, VGS = 0V,
f = 1MHz
f = 1MHz
1385 1845 pF
275
365
pF
230
345
pF
4.5
Switching Characteristics
td(on)
tr
td(off)
tf
Qg
Qg
Qgs
Qgd
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Total Gate Charge
Gate to Source Charge
Gate to Drain “Miller” Charge
VDD = -15V, ID = -8.8A,
VGS = -10V, RGEN = 6
VGS = 0V to -10V
VGS = 0V to -5V
VDD = -15V,
ID = -8.8A
10
20
ns
6
12
ns
30
48
ns
12
22
ns
28
40
nC
16
23
nC
5.2
nC
7.4
nC
Drain-Source Diode Characteristics
VSD
Source to Drain Diode Forward Voltage VGS = 0V, IS = -8.8A (Note 2)
-0.9
-1.2
V
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IF = -8.8A, di/dt = 100A/µs
29
44
ns
23
35
nC
NOTES:
1. RθJA is determined with the device mounted on a 1in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by
the user's board design.
a. 50°C/W when mounted on
a 1 in2 pad of 2 oz copper.
b. 125°C/W when mounted on
a minimum pad of 2 oz copper.
2. Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%.
3. The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied.
4. Starting TJ = 25°C, L = 1mH, IAS = -7A, VDD = -30V, VGS = -10V
©2007 Fairchild Semiconductor Corporation
2
FDS4435BZ Rev.C
www.fairchildsemi.com
 

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]