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G30N60C3D View Datasheet(PDF) - Unspecified

Part Name
Description
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G30N60C3D Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
HGTG30N60C3D
Packaging
E
ØR
D
A
Q
TERM. 4
ØS ØP
L1
L
b1
b2
c
b
1
2
3
e
J1
e1
3
2
1
BACK VIEW
LEAD NO. 1 - GATE
LEAD NO. 2 - COLLECTOR
LEAD NO. 3 - EMITTER
TERM. 4
- COLLECTOR
TO-247
3 LEAD JEDEC STYLE TO-247 PLASTIC PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.180
0.190
4.58
4.82
-
b
0.046
0.051
1.17
1.29
2, 3
b1
0.060
0.070
1.53
1.77
1, 2
b2
0.095
0.105
2.42
2.66
1, 2
c
0.020
0.026
0.51
0.66
1, 2, 3
D
0.800
0.820 20.32
20.82
-
E
0.605
0.625 15.37
15.87
-
e
0.219 TYP
5.56 TYP
4
e1
0.438 BSC
11.12 BSC
4
J1
0.090
0.105
2.29
2.66
5
L
0.620
0.640 15.75
16.25
-
L1
0.145
0.155
3.69
3.93
1
ØP
0.138
0.144
3.51
3.65
-
Q
0.210
0.220
5.34
5.58
-
ØR
0.195
0.205
4.96
5.20
-
ØS
0.260
0.270
6.61
6.85
-
NOTES:
1. Lead dimension and finish uncontrolled in L1.
2. Lead dimension (without solder).
3. Add typically 0.002 inches (0.05mm) for solder coating.
4. Position of lead to be measured 0.250 inches (6.35mm) from bottom
of dimension D.
5. Position of lead to be measured 0.100 inches (2.54mm) from bottom
of dimension D.
6. Controlling dimension: Inch.
7. Revision 1 dated 1-93.
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Harris Semiconductor products are sold by description only. Harris Semiconductor reserves the right to make changes in circuit design and/or specifications at
any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Harris is
believed to be accurate and reliable. However, no responsibility is assumed by Harris or its subsidiaries for its use; nor for any infringements of patents or other
rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Harris or its subsidiaries.
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SEMICONDUCTOR
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