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MC33064 View Datasheet(PDF) - ON Semiconductor

Part NameDescriptionManufacturer
MC33064 Undervoltage Sensing Circuit ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC33064 Datasheet PDF : 12 Pages
First Prev 11 12
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
DM SUFFIX
PLASTIC PACKAGE
CASE 846A−02
(Micro8)
ISSUE F
−A−
K
−B−
PIN 1 ID G
SEATING
−T− PLANE
0.038 (0.0015)
D 8 PL
0.08 (0.003) M T B S A S
C
H
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 2.90 3.10 0.114 0.122
B 2.90 3.10 0.114 0.122
C −−− 1.10 −−− 0.043
D 0.25 0.40 0.010 0.016
G
0.65 BSC
0.026 BSC
H 0.05 0.15 0.002 0.006
J 0.13 0.23 0.005 0.009
K 4.75 5.05 0.187 0.199
L 0.40 0.70 0.016 0.028
SOLDERING FOOTPRINT*
1.04
8X 0.041
0.38
0.015 8X
3.20
0.126
4.24 5.28
0.167 0.208
0.65
6X 0.0256
ǒ Ǔ SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
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