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BTA08-600SWRG View Datasheet(PDF) - STMicroelectronics

Part NameDescriptionManufacturer
BTA08-600SWRG Snubberless™, logic level and standard 8 A Triacs ST-Microelectronics
STMicroelectronics ST-Microelectronics
BTA08-600SWRG Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
BTA08, BTB08 and T8 Series
Characteristics
Figure 7. Non-repetitive surge peak on-state
current for a sinusoidal
Figure 8. Relative variation of gate trigger
current
ITSM(A), I2t (A2s)
1000
Tj initial=25°C
dI/dt limitation:
50A/µs
ITSM
100
360°
α
I2t
pulse with width tp < 10 ms and corresponding value of I2t
tp(ms)
10
0.01
0.10
1.00
10.00
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
2.5
holding current and latching current
versus junction temperature (typical values)
2.0
IGT
1.5
IH & IL
1.0
0.5
Tj(°C)
0.0
-40 -20
0
20 40 60 80 100 120 140
Figure 9.
Relative variation of critical rate of Figure 10. Relative variation of critical rate of
decrease of main current versus
decrease of main current versus
(dV/dt)c (typical values)
(dV/dt)c (typical values)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.2
2.0
TW
Snubberless and Logic level types
1.8
1.6
1.4
1.2
T835/CW/BW
1.0
0.8
T810/SW
0.6
0.4
0.2
0.0
0.1
(dV/dt)c (V/µs)
1.0
10.0
100.0
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
1.8
1.6
C
1.4
1.2
B
1.0
0.8
0.6
0.4
0.1
(dV/dt)c (V/µs)
1.0
10.0
Standard types
100.0
Figure 11. Relative variation of critical rate of Figure 12. DPAK and D2PAK thermal resistance
decrease of main current versus
junction to ambient versus copper
junction temperature
surface under tab
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
6
5
Rth(j-a)(°C/W)
100
90
80
printed circuit board FR4, copper thickness: 35 µm
4
70
60
3
50
DPAK
40
2
30
D2PAK
1
20
Tj(°C)
10
S(cm²)
0
0
0
25
50
75
100
125
0 4 8 12 16 20 24 28 32 36 40
Doc ID 7472 Rev 7
5/12
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