MC14020BFL2 View Datasheet(PDF) - ON Semiconductor
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MC14020BFL2 Datasheet PDF : 8 Pages
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MC14020B
PACKAGE DIMENSIONS
0.15 (0.006) T U S
16
2X L/2
L
PIN 1
IDENT.
1
0.15 (0.006) T U S
C
0.10 (0.004)
−T− SEATING
PLANE
D
TSSOP−16
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F−01
ISSUE B
16X K REF
0.10 (0.004) M T U S V S
9
J1
B
−U− J
N
8
K
ÇÇÉÉÇÇÉÉK1ÇÇÉÉ
SECTION N−N
0.25 (0.010)
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE -W-.
A
−V−
G
N
F
DETAIL E
H DETAIL E
−W−
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G
0.65 BSC
0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L
6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
SOLDERING FOOTPRINT
7.06
1
16X
0.36
16X
1.26
0.65
PITCH
DIMENSIONS: MILLIMETERS
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