CXK581000AM-55LL View Datasheet(PDF) - Sony Semiconductor
Part Name
Description
View to exact match
CXK581000AM-55LL Datasheet PDF : 12 Pages
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CXK581000ATM/AYM/AM/AP
Package Outline
Unit: mm
CXK581000ATM
32PIN TSOP (I) (PLASTIC)
8.0 ± 0.2
32
17
+ 0.2
1.07 – 0.1
0.1
0.1 ± 0.1
+ 0.08 1
0.2 – 0.03
0.08 M
16
0.5
A
+ 0.05
0.127 – 0.02
0° to 10°
DETAIL A
NOTE: Dimension “∗” does not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP (I) -32P-L01
TSOP (I) 032-P-0820-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY / PHENOL RESIN
SOLDER PLATING
42 ALLOY
CXK581000AYM
32PIN TSOP (PLASTIC)
8.0 ± 0.2
17
32
+ 0.2
1.07 – 0.1
0.1
16
+ 0.08
0.2 – 0.03
0.08 M
1
0.5
A
0.1 ± 0.1
+ 0.05
0.127 – 0.02
0° to 10°
NOTE: Dimension “∗” does not include mold protrusion.
DETAIL A
PACKAGE STRUCTURE
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP-32P-L01R
TSOP032-P-0820-B
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
42 ALLOY
0.3g
– 11 –
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