S2B View Datasheet(PDF) - General Semiconductor
Part Name
Description
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S2B Datasheet PDF : 2 Pages
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S2A THRU S2M
SURFACE MOUNT GLASS PASSIVATED SILICON RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 1.5 Amperes
DO-214AA
MODIFIED J-BEND
0.086 (2.20)
0.077 (1.95)
0.155 (3.94)
0.130 (3.30)
0.096 (2.44)
0.084 (2.13)
0.180 (4.57)
0.160 (4.06)
0.012 (0.305)
0.006 (0.152)
0.060 (1.52)
0.030 (0.76)
0.008 (0.203)
MAX.
0.220 (5.59)
0.205 (5.21)
Dimensions in inches and (millimeters)
FEATURES
♦ Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
♦ For surface mounted applications
♦ Low profile package
♦ Built-in strain relief,
ideal for automated placement
♦ Glass passivated chip junction
♦ High temperature soldering:
250°C/10 seconds at terminals
MECHANICAL DATA
Case: JEDEC DO-214AA molded plastic body over
passivated chip
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Weight: 0.003 ounce, 0.093 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS S2A
S2B
Device marking code
SA
SB
Maximum repetitive peak reverse voltage
VRRM
50 100
Maximum RMS voltage
VRMS
35 70
Maximum DC blocking voltage
VDC
50 100
Maximum average forward rectified current
at TL=100°C
I(AV)
Peak forward surge current
8.3ms single half sine-wave superimposed
IFSM
on rated load (JEDEC Method) TL=100°C
Maximum instantaneous forward voltage at 1.5 A
VF
Maximum DC reverse current
at Rated DC blocking voltage
TA=25°C
TA=125°C
IR
Typical reverse recovery time (NOTE 1)
trr
Typical junction capacitance (NOTE 2)
CJ
Typical thermal resistance (NOTE 3)
RΘJA
RΘJL
Operating and storage temperature range
TJ, TSTG
S2D
S2G
S2J
SD
SG
SJ
200 400 600
140 280 420
200 400 600
1.5
50.0
1.15
1.0
125.0
2.0
30.0
53.0
16.0
-55 to +150
S2K
S2M UNITS
SK
SM
800 1000 Volts
560 700 Volts
800 1000 Volts
Amps
Amps
Volts
µA
µs
pF
°C/W
°C
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient and junction to lead
P.C.B. mounted on 0.27 x 0.27” (7.0 x 7.0mm) copper pad areas
4/98
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