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ADF4117BRUZ1 View Datasheet(PDF) - Analog Devices

Part Name
Description
View to exact match
ADF4117BRUZ1
ADI
Analog Devices ADI
ADF4117BRUZ1 Datasheet PDF : 20 Pages
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ADF4116/ADF4117/ADF4118
ABSOLUTE MAXIMUM RATINGS1, 2
(TA = 25°C unless otherwise noted)
AVDD to GND3 . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
VP to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VP to AVDD . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
Digital I/O Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V
Analog I/O Voltage to GND . . . . . . . . . –0.3 V to VP + 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150°C
TSSOP θJA Thermal Impedance . . . . . . . . . . . . . 150.4°C/W
CSP θJA Thermal Impedance
(Paddle Soldered) . . . . . . . . . . . . . . . . . . . . . . . . . 122°C/W
(Paddle Not Soldered) . . . . . . . . . . . . . . . . . . . . . . 216°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2 This device is a high-performance RF integrated circuit with an ESD rating of
< 2 kV and it is ESD sensitive. Proper precautions should be taken for handling
and assembly.
3 GND = AGND = DGND = 0 V.
TRANSISTOR COUNT
6425 (CMOS) and 303 (Bipolar).
CLOCK
DATA
DB20 (MSB)
t1
t2
DB19
LE
t3
t4
DB2
DB1
(CONTROL BIT C2)
LE
Figure 1. Timing Diagram
DB0 (LSB)
(CONTROL BIT C1)
t6
t5
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumu-
late on the human body and test equipment and can discharge without detection. Although the
ADF4116/ADF4117/ADF4118 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
Model
Temperature Range
ADF4116BRU
ADF4116BCP
ADF4117BRU
ADF4117BCP
ADF4118BRU
ADF4118BCP
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
*Contact the factory for chip availability.
ORDERING GUIDE
Package Description
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package
Package Option*
RU-16
CP-20
RU-16
CP-20
RU-16
CP-20
–4–
REV. 0
 

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