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BTA/BTB12-XXXBW View Datasheet(PDF) - STMicroelectronics

Part Name
Description
View to exact match
BTA/BTB12-XXXBW
ST-Microelectronics
STMicroelectronics ST-Microelectronics
BTA/BTB12-XXXBW Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
BTA/BTB12 and T12 Series
Fig. 9: Relative variation of critical rate of
decrease of main current versus junction
temperature.
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
6
5
4
3
2
1
Tj (°C)
0
0
25
50
75
100
125
PACKAGE MECHANICAL DATA
D²PAK (Plastic)
L2
L
L3
A
E
C2
D
A1
B2
C
R
B
G
A2
2.0 MIN.
FLAT ZONE
V2
Fig. 10: D²PAK Thermal resistance junction to
ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 µm).
Rth(j-a) (°C/W)
80
D²PAK
70
60
50
40
30
20
10
S(cm²)
0
0 4 8 12 16 20 24 28 32 36 40
DIMENSIONS
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A 4.30
4.60 0.169
0.181
A1 2.49
2.69 0.098
0.106
A2 0.03
0.23 0.001
0.009
B 0.70
0.93 0.027
0.037
B2 1.25 1.40
0.048 0.055
C 0.45
0.60 0.017
0.024
C2 1.21
1.36 0.047
0.054
D 8.95
9.35 0.352
0.368
E 10.00
10.28 0.393
0.405
G 4.88
5.28 0.192
0.208
L 15.00
15.85 0.590
0.624
L2 1.27
1.40 0.050
0.055
L3 1.40
1.75 0.055
0.069
R
0.40
0.016
V2
8° 0°
FOOTPRINT DIMENSIONS (in millimeters)
D²PAK (Plastic)
16.90
10.30
8.90
6/7
5.08
1.30
3.70
 

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